Tezzaron in the News

Tezzaron/Rambus deal in the news

Last week we announced an agreement with Rambus.  This week EE|Times covers our announcement in detail:

‘Tezzaron Semiconductor will be the first customer to incorporate Rambus oxide-resistive memory (ReRAM) technology in forthcoming devices … Bob Patti, Tezzaron’s CTO, said the company sees short-term potential … [Read More]

Tezzaron and Rambus Ink Agreement

Tezzaron and Rambus announce an agreement enabling Tezzaron to implement ReRAM in its own products. ReRAM is a Rambus non-volatile oxide-resistive memory technology with significant power and speed advantages.

The agreement also enables Tezzaron’s manufacturing subsidiary, Novati, to build ReRAM into its customers’ devices.

Read the press release here:
[Read More]

Looking Back on a Major Milestone

Ten years ago today — on 21 October 2004 — Tezzaron demonstrated the world’s first working 3D-IC!

The device was a two-layer wafer-stacked chip with tungsten SuperContact™ (vertical interconnect).  It was part of an in-house multi-project wafer stack containing six different 3D designs, all of which were first-pass functional.  The first … [Read More]

Novati named a “Trusted” Fab

Novati Technologies, Tezzaron’s manufacturing subsidiary in Austin, has been awarded the coveted “Trusted Foundry” accreditation.  Novati is one of only nine companies so designated by the U.S. Department of Defense. “Trusted Foundries” are qualified to perform highest-security semiconductor production.  You can read the Novati press release … [Read More]