Tezzaron in the News

New memory technologies – that’s our favorite thing!

Tezzaron will participate in a “TechXPOT” session on July 14: “Emerging Generation Memory Technology: Update on 3DNAND, MRAM and RRAM”

The session is part of SEMICON West – and if you’re not signed up yet, better hurry!  You can still get a … [Read More]

This year’s InterPACK (International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems) is July 6-9 in San Francisco, held jointly with the International Conference on Nanochannels, Microchannels and Minichannels (ICNMM).  It promises a fascinating array of papers, presentations, seminars, speakers, tutorials, and workshops.  … [Read More]

Monolithic 3D (M3D), wafer-stacking with TSV (3DIC), and other buzz-worthy technologies are examined in the latest blog entry by Françoise von Trapp – “Queen of 3D.” She quotes some leading industry experts and notes: “Tezzaron’s 1µm tungsten TSVs are another attractive alternative in between 3DIC and M3D … currently, the … [Read More]

Paula Doe, technology director at SEMI, published a SEMICON West Preview on May 5.  It featured a good summary of our oxygen vacancy ReRAM effort, including this line:  “Patti says his company’s aerospace/military customers, who … [Read More]

A multi-project wafer (MPW) is a vehicle that allows several entities to share the costs and risks of building prototypes.  Tezzaron has participated in several MPWs for 3D-IC prototypes.  A valuable partner is CMP (Circuits Multi Projets) in France.  Kholdoun Torki of CMP gives an excellent description of the 3D … [Read More]