Cadence® press release touts Tezzaron as a customer May11 By Webmaster • Posted in Tezzaron in the News May 11, 2016 Tezzaron uses tools from several vendors, including Cadence Design Systems, Inc. On Monday Cadence issued this press release: “Tezzaron Cuts Design Time in Half with Cadence Full-Flow Digital RTL-to-Signoff Solution”
Nice press coverage – from Japan! Feb4 By Webmaster • Posted in Tezzaron in the News February 4, 2016 Last November Tezzaron had a presence at the SC15 conference. In January, our booth and its message received some very nice online coverage from a Japanese news site. They published a very thorough write-up with several photos. (Thank you, Mynavi!) For those who don’t read Japanese, … [Read More]
Nice little video Jan29 By Webmaster • Posted in Tezzaron in the News January 29, 2016 Last year we posted the news that Bob Patti had received the 2015 “3D InCites Individual Achievement Award.” At the request of a long-time investor, we are posting a link to the nice little video that was presented with the award. (And a special thank you … [Read More]
More Power! Jan20 By Webmaster • Posted in Tezzaron in the News January 20, 2016 If you want to go faster, you need more power. Right? Maybe not, says Jeremy Hsu, writing in IEEE Spectrum. He warns that power problems currently threaten to strangle super-fast computers. In fact, an exascale computer built with old-school technology might require its own nuclear power plant. … [Read More]
Tezzaron at 3D ASIP Dec30 By Webmaster • Posted in Tezzaron in the News December 30, 2015 On Dec 15-17, RTI International hosted its twelfth conference on 3D Architectures for Semiconductor Integration and Packaging (3D ASIP) — it’s the leading industry event in 3D integration and packaging. Tezzaron attended (as always), presented (as usual), and also sponsored the event. This year’s agenda was not … [Read More]