Tezzaron in the News

Tezzaron Launches RAM in a New Dimension

Naperville, IL – November 22, 2004

Tezzaron Semiconductor today announced the world’s first 3D-IC RAM chip. The re-programmable memory (RAM) device was built as a three-dimensional integrated circuit (3D IC) – two layers of circuitry with vertical interconnects that allow them to behave as a single device. This technology is expected … [Read More]

Tezzaron Wins $1M in Purchase Orders

Naperville, IL – 10 May, 2004

A new memory product from Tezzaron Semiconductor has generated over one million dollars in purchase orders. Tezzaron’s CTO, Bob Patti, says: “We’ve presented this product to only a handful of customers. The response has been tremendous!” The new 3T-iRAM™ memories promise higher reliability and lower … [Read More]

Tezzaron Announces Commercial 3D ICs

Naperville, IL – April 14, 2004

Tezzaron Semiconductor has announced commercially available products built with its FaStack™ 3D integration process. These fully integrated three-dimensional circuits (3D ICs) are available for general purchase; Tezzaron has already received purchase orders. Tezzaron plans to ship two types of commercial parts by the end of … [Read More]

New Memory Technology is World’s Fastest

Naperville, IL – August 18, 2003

Tezzaron Semiconductor today announced a prototype memory device with record-breaking speed: 1.3 nanosecond (ns) latency, 1 ns cycle time, and a throughput of 2 Gigabits/sec on each pin. The underlying technology for this device is a patented 3-transistor cell that senses changes in electrical current … [Read More]