Chartered, Tezzaron Team Up to Deliver Ultra High-Speed Memory Solution Jun12 By Webmaster • Posted in Press Releases June 12, 2007 Leading foundry, innovative chip designer will also collaborate on breakthrough 3D ICs using wafer stacking approach MILPITAS, Calif. – June 12, 2007 Chartered Semiconductor Manufacturing (Nasdaq: CHRT and SGX-ST: Chartered), one of the world’s top dedicated foundries, and Tezzaron Semiconductor, a specialist in high-speed memory solutions and three-dimensional (3D) wafer stacking processes, … [Read More]
Tezzaron in the News: 2006 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2006 October 2006: Designing in the Third Dimension (EDN Asia) October 2006: Wafer-Level 3-D Integration Moving Forward (Semiconductor International) August 2006: 3-D Requires System Rethink (EE Times) June 2006: Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs (Proceedings of the IEEE, Vol. 94, No. 6) March 2006: IME … [Read More]
Tezzaron in the News: 2005 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2005 November-December 2005: 3D Integration (IEEE Design & Test special issue) October 2005: Real Demand Drivers Appear for 3D ICs… (Wafer News and Solid State Technology) June 2005: Startup Profiles: Tezzaron (Semiconductor Times) June 2005: Three-Dimensional ICs Solve the Interconnect Paradox (Semiconductor International) May 2005: Terrazon [sic] applies 3D stacking … [Read More]
Tezzaron Inks Sales Rep Contracts for SRAM Sep19 By Webmaster • Posted in Press Releases September 19, 2005 Naperville, IL – September 19, 2005 Tezzaron’s memory products have attracted a team of world-class sales firms, giving the company an outside sales force of more than 50 people. The team includes Centaur North, Electronics Sales Professionals (ESP), Synergy Technical Sales, and TriStar Group. The firms average over 15 years’ experience … [Read More]
Tezzaron, PICC to Collaborate on 3D Flash Memory May9 By Webmaster • Posted in Press Releases May 9, 2005 Naperville, IL – May 9, 2005 Two innovative young companies, Tezzaron Semiconductor and Programmable Integrated Circuit Company (PICC), intend to collaborate on the creation of 3D flash memory components. The companies have executed a Letter of Intent outlining their agreement. PICC, a new “fabless” semiconductor company, owns patented flash technology that employs … [Read More]