3D Integration: New Opportunities for Speed, Power and Performance Feb7 By Webmaster • Posted in Documents February 7, 2012 A Tezzaron presentation from the 3D-IC Summer School in Buenos Aires Download PDF: 3D Integration: New Opportunities for Speed, Power and Performance
3D-ICs and Integrated Circuit Security Jan31 By Webmaster • Posted in Documents January 31, 2008 A Tezzaron white paper. Download pdf: 3D-ICs and Integrated Circuit Security
3D Super-Via for Memory Applications Jan31 By Webmaster • Posted in Documents January 31, 2007 A Tezzaron presentation from the 2007 Micro-Systems Packaging Initiative Workshop Download PDF: 3D Super-Via for Memory Applications Note: The demo video (3D-IC Microprocessor Prototype) referenced on page 16 is available here.
3-D Power Savings Jan31 By Webmaster • Posted in Documents January 31, 2007 A Tezzaron white paper: brief discussion of power savings enabled by 3D Download PDF: 3-D Power Savings
Techniques for Producing 3D ICs with High-Density Interconnect Oct31 By Webmaster • Posted in Documents October 31, 2004 A Tezzaron presentation from the 2004 VLSI Multi-Level Interconnection Conference (VMIC) Techniques for Producing 3D ICs with High-Density Interconnect