Tezzaron/Fermi detector chip makes news again Nov10 By Webmaster • Posted in Industry News November 10, 2014 Eight years ago Tezzaron and Fermilab began working on a radically new detector chip built in 3D. The latest version of that project (now called VIPIC) recently reported excellent results. Today, VIPIC is the focus of three US labs — … [Read More]
More About 3D-TEST Nov3 By Webmaster • Posted in Industry News November 3, 2014 3D-TEST Workshop Does What Its Name Says: Concentrates On 3D-Test Good coverage of an important conference, reported by Erik Jan Marinissen of imec.
3D Test Oct30 By Webmaster • Posted in Industry News October 30, 2014 At the 5th Annual 3D Test Workshop (Seattle, 23-24 October 2014) Tezzaron’s Bob Patti took part in a lively panel discussion. The consensus was that built-in self test and built-in self repair are essential for stacked memory devices. Tezzaron obviously agrees — our robust … [Read More]
Fermilab 3D Sensor Breakthrough Sep23 By Webmaster • Posted in Industry News September 23, 2014 A new 3D sensor prototype with extraordinary capabilities was recently revealed by Grzegorz Deptuch of Fermilab. The three-layer sensor, named VIPIC, is designed for particle detection in large-scale particle physics and x-ray imaging experiments. It exhibits higher and more uniform gain, higher signal amplitude, lower input capacitance, and much lower … [Read More]
COSMOS, DAHI, and mixed-material 3D Aug29 By Webmaster • Posted in Industry News August 29, 2014 A hotly-pursued goal of 3D-IC technology is the integration of circuitry built on different substrates. Phil Garrou reports in his blog, “Insights from the Leading Edge,” that DARPA is leading the way with its COSMOS and DAHI programs. Tezzaron and Novati are participants in these programs. You can read Phil’s … [Read More]