3D Test Oct30 By Webmaster • Posted in Industry News October 30, 2014 At the 5th Annual 3D Test Workshop (Seattle, 23-24 October 2014) Tezzaron’s Bob Patti took part in a lively panel discussion. The consensus was that built-in self test and built-in self repair are essential for stacked memory devices. Tezzaron obviously agrees — our robust Bi-STAR® (Built-in Self Test And Repair) is already incorporated in our multi-layer memories. Francoise von Trapp offers an overview of the event in her post: Putting 3D Integration to the Test.