The Tezzblog

3D Test

At the 5th Annual 3D Test Workshop (Seattle, 23-24 October 2014) Tezzaron’s Bob Patti took part in a lively panel discussion.  The consensus was that built-in self test and built-in self repair are essential for stacked memory devices.  Tezzaron obviously agrees — our robust Bi-STAR® (Built-in Self Test And Repair) is already incorporated in our multi-layer memories.

Francoise von Trapp offers an overview of the event in her post: Putting 3D Integration to the Test.