3D — it’s a DARPA thing! Jul9 By Webmaster • Posted in Industry News July 9, 2015 If it seems like the whole world is jumping on the 3D bandwagon — well, it is! But one of the earliest advocates, and also one of the most powerful, is DARPA (Defense Advanced Research Projects Agency). This US agency has cultivated, funded, and supported cutting-edge research ever … [Read More]
Committed to 3D Jun26 By Webmaster • Posted in Industry News June 26, 2015 “Once you’ve made the decision to go 3D there’s no way back.” That’s the word from Eric Beyne, Scientific Director Advanced Packaging & Interconnect for imec. He went on to say: “If you need high-bandwidth memory, for example, then you’re committed to some sort of 3D.” We couldn’t agree more! Read … [Read More]
What’s Hot in 2015? Jan21 By Webmaster • Posted in Industry News January 21, 2015 It’s January, so pundits of all stripes are publishing their predictions for the year ahead. (Spoiler: 3D is hot!) Solid State Technology collected the opinions of several leading lights in 2015 outlook: Tech trends and drivers Semiconductor Engineering’s Brian Bailey reports Manufacturing And Packaging Changes For 2015 For more, … [Read More]
3D-IC Meeting in Kinsale, Ireland Jan19 By Webmaster • Posted in Industry News January 19, 2015 The IEEE International Conference on 3D System Integration (3DIC) was held in Kinsale, Ireland, on 1-3 December 2014. Tezzaron was on the organizing committee. The event was reported by Peter Ramm in 3D InCites: Popping the Cork on 3D IC at IEEE 3DIC 2014 and by Phil Garrou … [Read More]
Getting Down to Business at 3D ASIP Dec30 By Webmaster • Posted in Industry News December 30, 2014 Tezzaron was a Platinum Sponsor for RTI’s 3D ASIP conference on December 10-12. This was the eleventh year for 3D ASIP (3D Architectures for Semiconductor Integration and Packaging) and the eleventh year of Tezzaron’s participation. As always, the event offered excellent presentations by several industry leaders … [Read More]