The Tezzblog

Tezzaron’s 3D-IC memories are featured in the latest issue of Scientific Computing World, in the article Memories of the Future. Author Robert Roe takes a deep look, exploring new memory challenges in high-performance computing (HPC). He outlines several innovations now in development and concludes … [Read More]

Tezzaron CTO Bob Patti participated in this year’s S3S conference as both presenter and panel member. He presented 2.5/3D Technology and Commercialization, emphasizing the cost-effectiveness, availability, and versatility of advanced packaging options. The panel, “Monolithic 3D vs. 3D TSVs,” prompted lively audience participation as … [Read More]

Semiconductor technology is a powerful and growing force in the world economy. Smart devices, the Internet, and the looming Internet of Things are global engines of economic progress – and they stand on the bedrock of semiconductors.
On Oct 25, the U.S. Council on Competitiveness met in Chicago as part … [Read More]

Can you get both in the same chip? It used to be a classic trade-off: higher performance meant more power consumption, power savings meant slower chips. Not any more, says Ed Sperling in his latest article, Lower Power Plus Better Performance; new computer and chip architectures … [Read More]

A new report by A to Z Research paints a rosy picture of our industry, predicting a market value of $8.6 Billion by 2020. As a featured “end player” in this report, Tezzaron agrees: the future looks bright.