The Tezzblog

3D Integration: Bringing Sexy Back?

Tezzaron CTO Bob Patti participated in this year’s S3S conference as both presenter and panel member. He presented 2.5/3D Technology and Commercialization, emphasizing the cost-effectiveness, availability, and versatility of advanced packaging options. The panel, “Monolithic 3D vs. 3D TSVs,” prompted lively audience participation as reported by Francoise von Trapp in 3D Integration is Bringing Sexy Back. Advanced semiconductor packaging is, in her words, “the sexist thing the industry’s got going.”