Ten Custom 3D-ICs From Tezzaron Jul22 By Webmaster • Posted in Press Releases July 22, 2011 Company reports growing demand for stacked silicon devices NAPERVILLE, Illinois – July 22, 2011 In the past month Tezzaron Semiconductor delivered ten different proprietary, custom-built 3D-ICs to several customers. Each of the ten designs featured two layers of silicon interconnected by hundreds of thousands of TSVs. “We have delivered custom 3D-ICs before … [Read More]
Mentor Graphics Works With Tezzaron and MOSIS on 3D-IC Prototyping Service Jun3 By Webmaster • Posted in Tezzaron in the News June 3, 2011 Mentor Graphics Corporation (NASDAQ: MENT) today announced a cooperative effort with Tezzaron Semiconductor and MOSIS to provide IC designers with a way to economically develop and manufacture 3D-IC prototypes on multi-project wafers (MPWs). The process enables designs using tens of millions of through silicon vias (TSVs) with dimensions as small … [Read More]
Tezzaron’s Response to Intel’s Tri-Gate “3D” Transistor May29 By Webmaster • Posted in Opinion May 29, 2011 Intel’s new transistor is an impressive piece of technology – even more so because it is built in an extremely advanced 22nm process. However, calling this transistor “3D” has caused some understandable confusion between these transistors and our 3D-ICs (or 3D chips). Transistors are to a chip what bricks are to … [Read More]
Tezzaron Reports Outstanding 3D Success at ISPD Apr14 By Webmaster • Posted in Tezzaron in the News April 14, 2011 EETimes had a nice report on the recent International Symposium on Physical Design (ISPD), held March 27-30, 2011 in Santa Barbara, CA… read more on Monolithic 3D
Tezzaron in the News: 2010 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2010 December 2010: 3D Test Workshop Gets the Ball Rolling (Chip Scale Review) December 2010: Testing 3D ICs Deep in the Heart of Texas (Insights From the Leading Edge) December 2010: IEEE 3D IC Test Workshop Part 2 (Insights From the Leading Edge) December 2010: The Future is … [Read More]