The Tezzblog

Tezzaron in the News: 2010

December 2010: 3D Test Workshop Gets the Ball Rolling (Chip Scale Review)

December 2010: Testing 3D ICs Deep in the Heart of Texas (Insights From the Leading Edge)

December 2010: IEEE 3D IC Test Workshop Part 2 (Insights From the Leading Edge)

December 2010: The Future is Here … Bob Patti: 3D @ Tezzaron (EDA Confidential blog)

December 2010: 3D: Design. Deploy. Dominate. (EDN blog, “Superheroes of SOC”)

December 2010: Progress in 3-D IC production (Media & Entertainment Technologies)

December 2010: Focus on 3D TEST at IEEE Workshop (Advanced Packaging)

November 2010: First 3D-TEST Workshop (3D InCites blog)

November 2010: Manufacturing Service on 3D ICs (Slides from the IEEE 3DIC Conference in Munich)

August 2010: Global 3D Chips/3D IC Market to Reach US$5.2 Billion by 2015 (PRWeb)

July 2010: 3D Infrastructure Announcements and Rumors (Insights From the Leading Edge)

June 2010: CMP/CMC/MOSIS partner to introduce a 3D-IC process (Joint press release)

March 2010: 3-D IC at the IMAPS Packaging Conference (Perspectives from the Leading Edge)

March 2010: IMAPS Experts Debate 3_D Cost Challenges (Semiconductor International)

January 2010: 2009 SEMI Awards for North America Bestowed on Robert Patti of Tezzaron Semiconductor… (SEMI Press Release)

January 2010: Congratulations, Bob Patti! (3D InCites)