IEEE Santa Clara Valley Nov13 By Webmaster • Posted in Tezzaron Presents November 13, 2013 Tezzaron presents “Design, Manufacturing and Performance of a 3D Random Access Memory Subsystem” at IEEE Santa Clara Valley
IEEE 3D System Integration Conference Oct3 By Webmaster • Posted in Tezzaron Presents October 3, 2013 Tezzaron presents “A Perspective on Manufacturing 2.5/3D” at the IEEE 3D System Integration Conference (2013); we also chair a Test session and participate in a panel
3D-IC Video Processor Aug30 By Webmaster • Posted in Tezzaron in the News August 30, 2013 Tezzaron is very excited about a phenomenal “smart video” device built in our FaStack technology! Johns Hopkins University (JHU) and Universidad Nacional del Sur (UNS) worked together to develop a sensor-plus-processor in a single 3D-IC. The 2×2.5mm chip captures images and can process 30,000 frames per second! A prototype was built … [Read More]
Tezzaron: You’ve got our attention now Aug29 By Webmaster • Posted in Tezzaron in the News August 29, 2013 “Tezzaron Founder and CTO Bob Patti delivered a rousing keynote at the Silicon Valley Magma User Group meeting back in 2010, talking about his company’s 3D memory technology and how it offered a solution to the increased demands for on-chip capacity. I spoke to Patti following that speech…” [Read More]
MemCon 2013 Aug6 By Webmaster • Posted in Slide Presentations August 6, 2013 Tezzaron sponsored MemCon (in Santa Clara) and presented DiRAM™ Architecture Makes Disintegration a Good Thing; other presentations reinforced our story; response to Tezzaron was very positive.