Semiconductor Engineering Peers into the Future and Sees Tezzaron May13 By David Chapman • Posted in Industry News Opinion Tezzaron in the News May 13, 2020 When Bryon Moyer of Semiconductor Engineering decided to try and figure out the future of DRAM, everywhere he went he heard essentially the same story, (paraphrasing) “…we have not come up with any technology that beats it, so we will keep doing what we have always done…”, that … [Read More]
If You Really, Really Want to Know Oct10 By Webmaster • Posted in Industry News October 10, 2017 If you really, really (really, really, really) want to know how different Tezzaron’s technology is from what the rest of the industry is doing in 3D, the most complete answer possible (by way of contrast) has been published by IPC (inexplicably, the “IPC” is the Association Connecting Electronics Industries). If you … [Read More]
Is 7nm the Last Major Node? Jul27 By Webmaster • Posted in Opinion July 27, 2017 The title of this post is stolen from an article by Ed Sperling, published in Semiconductor Engineering, July 20, 2017. I reference it here to cite it as recommended reading. The list of problems with semiconductor processes beyond 10nm seem overwhelming. New nodes have always looked difficult to achieve, but I … [Read More]
Advanced Packaging: The Times are A-Changing? Apr10 By Webmaster • Posted in Tezzaron in the News April 10, 2017 Tezzaron gets a nod in the 3D InCites article: “The Advanced Packaging Times, they are A-Changing…or Are They?” The writeup (by Francoise von Trapp) provides a timely discussion of markets and drivers, fan-outs, SiP, and 3D TSVs.
Tezzaron’s 3D Processes & Patents Feb16 By Webmaster • Posted in Tezzaron in the News February 16, 2017 Bill Martin discussed (in 3D InCites) the IP and patent landscape of electronic system development. One case in point was a comparison of the 3D processes used by Tezzaron and Monolithic 3D. He concludes that the two companies “do not need to chase the smaller nodes … that … [Read More]