Tezzaron in the News: 2011 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2011 December 2011: Honeywell, Tezzaron Semi partner to develop 3D chips for military/aero applications (Smart Brief) December 2011: Rad-hard 3D integrated circuit design for aerospace and defense is goal of Honeywell-Tezzaron partnership (Military & Aerospace Electronics) December 2011: Honeywell taps Tezzaron Semiconductor to stack rad-hard die (ElectroIQ) December 2011: Honeywell and Tezzaron to Build Rad Hard 3D-ICs (joint press release) December 2011: IME, Tezzaron develop “2.5D” interposer tech (EE Times Asia) December 2011: Silicon interposer partnership sets roadmap (ElectroIQ) December 2011: Singapore duo to streamline interposer production (ElectronicsWeekly) December 2011: A*STAR and Tezzaron Team Up to Develop 2.5D/3D Technology (joint press release) November 2011: 3D stack design: a tale from the frontline (ElectronicsWeekly.com) November 2011: Building 3D-ICs: Tool Flow and Design Software: Part 1 and Part 2 (EE Times) October 2011: Biting Into the New Silicon Sandwich (EE Times Confidential) October 2011: Perfecting the 3-D chip (EE Times) September 2011: 3-D IC panel – CICC (Media and Entertainment Technologies) July 2011: Thin Film Polymer Apps from the 2011 ECTC; Tezzaron 3D Activity (Insights From the Leading Edge) July 2011: Ten Custom 3D-ICs from Tezzaron (Tezzaron press release) July 2011: Elpida and MOSIS Ready for 3D IC; TSV Going “Where the Sun Don’t Shine” (Insights From the Leading Edge) June 2011: Invited Talk at the 3D satellite workshop at the TIPP2011 (MonolithIC blog) June 2011: EDA tools pave path to 3-D ICs (EDN) June 2011: Mentor Graphics Works With Tezzaron and MOSIS on 3D-IC Prototyping Service (Mentor) April 2011: Tezzaron Reports Outstanding 3D Success at ISPD (MonolithIC 3D) April 2011: ISPD spots 3-D, maskless-lithography trends (EE Times) February 2011: Micron reveals “Hyper Memory Cube” 3DIC Technology (i-Micronews) January 2011: 3D Highlights at the RTI 3D ASIP Part 1 (Insights From the Leading Edge) January 2011: Outlook and Trends 2011: A Perspective (SMT Magazine)