Early alert: 3DIC 2016 Jan27 By Webmaster • Posted in Industry News January 27, 2016 The IEEE International Conference on 3D System Integration (3DIC 2016) will be held in San Francisco on November 8-10, 2016. Conference co-chairs are Paul Franzon of NCSU and our own Bob Patti. The conference will cover all 3D-IC topics including 3D process technology, materials, equipment, circuits technology, design methodology, and applications. Deadline for papers and proposals is May 31, 2016 – see Call for Papers.