Tezzaron Presents

INFIERI in Madrid

Tezzaron presents “New Developments from Tezzaron” and “3D Vertical Interconnect Software Kits” at the INFIERI Workshop in Madrid: “Intelligent Front-End Signal Processing for Frontier Exploitation in Research and Industry

IEEE 3D System Integration Conference

Tezzaron presents “A Perspective on Manufacturing 2.5/3D” at the IEEE 3D System Integration Conference (2013); we also chair a Test session and participate in a panel