Tezzaron at 3D ASIP 2016 Dec29 By Webmaster • Posted in Tezzaron in the News December 29, 2016 This year’s 3D ASIP conference attracted the usual crowd of innovators and enthusiasts. Tezzaron’s CTO (Bob Patti) was in attendance, and was quoted in an entertaining report: Hugo Pristauz Drops the F-bomb at 3D ASIP 2016, You Won’t Believe What Happens Next!
Memories of the Future Nov3 By Webmaster • Posted in Tezzaron in the News November 3, 2016 Tezzaron’s 3D-IC memories are featured in the latest issue of Scientific Computing World, in the article Memories of the Future. Author Robert Roe takes a deep look, exploring new memory challenges in high-performance computing (HPC). He outlines several innovations now in development and concludes … [Read More]
3D Integration: Bringing Sexy Back? Nov3 By Webmaster • Posted in Tezzaron in the News November 3, 2016 Tezzaron CTO Bob Patti participated in this year’s S3S conference as both presenter and panel member. He presented 2.5/3D Technology and Commercialization, emphasizing the cost-effectiveness, availability, and versatility of advanced packaging options. The panel, “Monolithic 3D vs. 3D TSVs,” prompted lively audience participation as … [Read More]
3D-ICs: USD 8.6 Billion by 2020? Oct11 By Webmaster • Posted in Tezzaron in the News October 11, 2016 A new report by A to Z Research paints a rosy picture of our industry, predicting a market value of $8.6 Billion by 2020. As a featured “end player” in this report, Tezzaron agrees: the future looks bright.
Three new reports cite Tezzaron Jul15 By Webmaster • Posted in Tezzaron in the News July 15, 2016 Tezzaron is cited in three new industry reports announced this week: 3D TSV Packages Market 2016-2026 Shares, Trend and Growth Report Press release from: Future Market Insights Emerging Non-Volatile Memory – 2016 Report by Yole Developpement 3D IC Market by Substrate Type and by Fabrication Process Report by Market Research … [Read More]