Tezzaron tips 3-D memory, signs up SVTC Dec10 By Webmaster • Posted in Tezzaron in the News December 10, 2009 Struggling to bring its 3-D chip technology into the mainstream, Tezzaron Semiconductor Corp. is taking several steps to reverse its misfortunes. As part of the moves, Tezzaron (Naperville, Ill.) has formed an alliance with SVTC Technologies Inc., an R&D foundry. Tezzaron continues to work with its original foundry partner…read more on … [Read More]
Tezzaron in the News: 2008 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2008 December 2008: Labs and industry perfect 3-D chip (Symmetry) November 2008: You Can’t Always Get What You Want (Perspectives from the Leading Edge) October 2008: As ICs stack up, cleanliness levels may follow (CleanRooms) October 2008: Labs and companies collaborate on pixel detector technology (Fermilab Today) July 2008: Recent 3D … [Read More]
Labs and industry perfect 3-D chip Dec8 By Webmaster • Posted in Tezzaron in the News December 8, 2008 Labs and industry perfect 3-D chip…read more on Symmetry
3-D Chip Stacks Standardized Jul10 By Webmaster • Posted in Tezzaron in the News July 10, 2008 The Intimate Memory Interconnect Standard (IMIS) being promoted by the 3D-IC Alliance recently released its official specification for 3-D stacking memory chips…read more on EEtimes
Tezzaron in the News: 2007 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2007 October 2007: $50 3D Bonding Coming?? (Perspectives from the Leading Edge) October 2007: IC Packages Feel the Squeeze (Electronic Design) June 2007: Tezzaron, Chartered working on 2D “iRAM” hybrid, 3D ICs to come (Wafer News) June 2007: Chartered, Tezzaron team for high-speed 3D memory chips (EDN) June 2007: Design in … [Read More]