Tezzaron in the News

Tezzaron tips 3-D memory, signs up SVTC

Struggling to bring its 3-D chip technology into the mainstream, Tezzaron Semiconductor Corp. is taking several steps to reverse its misfortunes.

As part of the moves, Tezzaron (Naperville, Ill.) has formed an alliance with SVTC Technologies Inc., an R&D foundry. Tezzaron continues to work with its original foundry partner…read more on … [Read More]

3-D Chip Stacks Standardized

The Intimate Memory Interconnect Standard (IMIS) being promoted by the 3D-IC Alliance recently released its official specification for 3-D stacking memory chips…read more on EEtimes