The Tezzblog

Tezzaron in the News: 2007


October 2007: $50 3D Bonding Coming?? (Perspectives from the Leading Edge)

October 2007: IC Packages Feel the Squeeze (Electronic Design)

June 2007: Tezzaron, Chartered working on 2D “iRAM” hybrid, 3D ICs to come (Wafer News)

June 2007: Chartered, Tezzaron team for high-speed 3D memory chips (EDN)

June 2007: Design in the age of 3-D Stacking (EE Times)

February 2007: Tezzaron readying MPW run for 3D memory/logic designs (WeSRCH)

January 2007: Making the Business Case for 3D (Future Fab Intl.)