Tezzaron in the News

Invensas Teams with Tezzaron

Invensas announced that it is partnering with Tezzaron to build a wide range of 3D-IC customer products.

Robert Patti of Tezzaron: “Today we can produce complete high-quality 2.5D (Silicon Interposer) and 3D silicon devices, but the final packaging flows are lacking. Invensas’ 3D-IC packaging expertise and existing pilot assembly line … [Read More]

Ziptronix Teams with Tezzaron and Novati Technologies to Accelerate Development of 3D ICs

Sells 3D IC development lab to Tezzaron; Novati Technologies to operate facility

Ziptronix Inc., provider of patented, low- temperature direct bonding technology for 3D integration, today announced an agreement with Tezzaron Semiconductor Corporation and Novati Technologies, a wholly owned subsidiary of Tezzaron, as a next step toward the acceleration of 3D … [Read More]

3D-IC Video Processor

Tezzaron is very excited about a phenomenal “smart video” device built in our FaStack technology!

Johns Hopkins University (JHU) and Universidad Nacional del Sur (UNS) worked together to develop a sensor-plus-processor in a single 3D-IC. The 2×2.5mm chip captures images and can process 30,000 frames per second! A prototype was built … [Read More]