Tezzaron at the Instrumentation Frontier Mar11 By Webmaster • Posted in Tezzaron in the News March 11, 2014 3D pixel-readout chip, designed by Fermilab consortium, built by Tezzaron “…Fermilab organized an international consortium of a dozen physics laboratories to produce a demonstration 3D pixel-readout chip. They chose Tezzaron Semiconductor, a leader in the 3D field, as an industrial partner…” Read the article in … [Read More]
Tezzaron in the News: 2013 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2013 December 2013: 2.5-D Stacks Pile Up at Event (EE Times) December 2013: Tezzaron, Ziptronix, and Invensas Demonstrate Interconnectology in Action (3D InCites) December 2013: Invensas and Tezzaron Partner to Deliver Commercial 3D IC Products (3D InCites) December 2013: Ziptronix Teams with Tezzaron and Novati Technologies … [Read More]
Invensas Teams with Tezzaron Dec12 By Webmaster • Posted in Press Releases December 12, 2013 Invensas announced that it is partnering with Tezzaron to build a wide range of 3D-IC customer products. Robert Patti of Tezzaron: “Today we can produce complete high-quality 2.5D (Silicon Interposer) and 3D silicon devices, but the final packaging flows are lacking. Invensas’ 3D-IC packaging expertise and existing pilot assembly line … [Read More]
Ziptronix Teams with Tezzaron and Novati Technologies to Accelerate Development of 3D ICs Dec9 By Webmaster • Posted in Press Releases December 9, 2013 Sells 3D IC development lab to Tezzaron; Novati Technologies to operate facility Ziptronix Inc., provider of patented, low- temperature direct bonding technology for 3D integration, today announced an agreement with Tezzaron Semiconductor Corporation and Novati Technologies, a wholly owned subsidiary of Tezzaron, as a next step toward the acceleration of 3D … [Read More]
3D-IC Video Processor Aug30 By Webmaster • Posted in Tezzaron in the News August 30, 2013 Tezzaron is very excited about a phenomenal “smart video” device built in our FaStack technology! Johns Hopkins University (JHU) and Universidad Nacional del Sur (UNS) worked together to develop a sensor-plus-processor in a single 3D-IC. The 2×2.5mm chip captures images and can process 30,000 frames per second! A prototype was built … [Read More]