More on the Tezzaron/Fermilab collaboration May15 By Webmaster • Posted in Industry News May 15, 2014 This is the new 2D prototype of Fermilab’s VIPRAM chip. The final version is to be built in 3D. See article “A chip off the new board” [here].
Strong Growth in High Performance Memory May9 By David Chapman • Posted in Industry News May 9, 2014 DigiTimes forecasts strong growth in the high performance, high value memory market in 2014. “Powered by demand from the cloud computing and big data sectors, the bit-growth rate of server DRAM chips will grow by an annual rate of 27.2% in 2014, slightly lower than the 28.8% of a year earlier … [Read More]
A powerful argument for 3D memory May8 By Webmaster • Posted in Industry News May 8, 2014 How much of an SoC’s area is consumed by memory? Semiconductor Engineering’s Brian Bailey reports: “Today it is closer to 50% to 55%. We have seen a few cases where it is more than 85% of the chip area. The trend line is up and to the right.” “It is more expensive … [Read More]
Invitation to Join the 3D Community May8 By Webmaster • Posted in Industry News May 8, 2014 Yesterday Francoise von Trapp published an enthusiastic and well-documented Open Letter to the chip design community: “It is my pleasure to inform you that the waiting time is over, and 3D ICs are ready to implement.” Read the … [Read More]
3D InCites covers the ITRS Roadmap Apr23 By Webmaster • Posted in Industry News April 23, 2014 “At the beginning of April, the Semiconductor Industry Association released the 2013 International Roadmap for Semiconductors (ITRS) … the combination of 3D device architecture and low power devices will usher in a new era of scaling identified in short as ‘3D Power Scaling.’ … all roads … [Read More]