“The Year of 3D Memory” Dec3 By Webmaster • Posted in Industry News December 3, 2015 EE Times and EDN announced predictions for next year — specifically, 15 Hot Tech Stories for 2016 including our favorite: The Year of 3D Memory “3D ICs have been around for a while, but now they’re getting real.” Indeed they are! Tezzaron’s own [Read More]
Fast 50! Nov2 By Webmaster • Posted in Industry News November 2, 2015 In October, Novati Technologies was named one of the Austin Business Journal’s “Fast 50” – the fastest growing companies in central Texas. For full story, click here. Big congrats to our co-workers in Texas!
Is Tezzaron’s 3D process “monolithic”? Oct15 By Webmaster • Posted in Industry News October 15, 2015 In the world of 3D ICs, definitions tend to morph and shift at a dizzying rate. There is disagreement on such basic terms as TSV, package, stack, and even 3D itself! The recent IEEE 3D Test Workshop saw a redefinition of “Monolithic 3D IC” that would include … [Read More]
Advanced Integrated Sensor Platform Sep30 By Webmaster • Posted in Industry News September 30, 2015 Novati Technologies (Tezzaron’s manufacturing subsidiary) announced a new wafer-stacked sensor technology that they will present at SEMICON Europa. The technology places sensors onto multi-layer stacks to consume less power, perform significantly faster, and reduce overall footprint. This is an exciting development with great promise … [Read More]
Tezzaron at SC15 Jul29 By Webmaster • Posted in Industry News July 29, 2015 High Performance Computing (HPC) is transforming the world, surging forward on a rising tide of technological innovation. From nanomaterials to medical treatments to disaster preparedness, HPC’s emerging technologies promise a tsunami of novel applications. The IEEE Supercomputing Conference 2015 (SC15) will be held in Austin, Texas, on 15-20 … [Read More]