Lower Power and Higher Performance Oct14 By Webmaster • Posted in Industry News October 14, 2016 Can you get both in the same chip? It used to be a classic trade-off: higher performance meant more power consumption, power savings meant slower chips. Not any more, says Ed Sperling in his latest article, Lower Power Plus Better Performance; new computer and chip architectures … [Read More]
Global 3D IC Market Rising Jul11 By Webmaster • Posted in Industry News July 11, 2016 Two recent reports give rosy predictions: Global 3D IC Market Set for Rapid Growth, To Reach Around USD 8.6 Billion by 2020 and Global 3D ICs Market to Log 18.1% CAGR till 2019 with Growing Demand
It’s All About the Memory! Apr15 By Webmaster • Posted in Industry News April 15, 2016 Remember when CPU speed was all-important? Things have changed. The mighty CPU is no longer the center of the computing universe; nowadays it’s all about the memory. (A Tezzaron memory chip is pictured above.) Memory-centric architectures are on the rise, as described by Ed Sperling in his latest … [Read More]
Where is the industry going? Feb22 By Webmaster • Posted in Industry News February 22, 2016 Among all the hype and hullabaloo, it’s wise to listen to reasoned industry voices. Here are two articles assessing the position of 3D and 2.5D today: Intercepting IC Products with a Disruptive Technology Option – by Riko Radojcic of 3D InCites Inside Advanced Packaging – an interview with … [Read More]
Early alert: 3DIC 2016 Jan27 By Webmaster • Posted in Industry News January 27, 2016 The IEEE International Conference on 3D System Integration (3DIC 2016) will be held in San Francisco on November 8-10, 2016. Conference co-chairs are Paul Franzon of NCSU and our own Bob Patti. The conference will cover all 3D-IC topics including 3D process technology, materials, … [Read More]