Where is the industry going? Feb22 By Webmaster • Posted in Industry News February 22, 2016 Among all the hype and hullabaloo, it’s wise to listen to reasoned industry voices. Here are two articles assessing the position of 3D and 2.5D today: Intercepting IC Products with a Disruptive Technology Option – by Riko Radojcic of 3D InCites Inside Advanced Packaging – an interview with Ron Huemoeller of Amkor