The Tezzblog

Where is the industry going?

Among all the hype and hullabaloo, it’s wise to listen to reasoned industry voices.  Here are two articles assessing the position of 3D and 2.5D today:

Intercepting IC Products with a Disruptive Technology Option – by Riko Radojcic of 3D InCites

Inside Advanced Packaging – an interview with Ron Huemoeller of Amkor