The Tezzblog

Want some real-world insight into 2.5D and 3D IC design and assembly? Read on to get the word from Tezzaron Semiconductor

Ann Steffora-Mutschler just published an interview with Robert Patti, chief technology officer at Tezzaron Semiconductor, that gives some terrific technical detail about 2.5D and 3D IC design and assembly. Patti provides some rare insight into today’s (as in right now) 2.5D/3D state of the art through some really interesting qualitative and quantitative statements and some hard-to-find-but compelling numbers in this interview… read more on EDA insider