The Tezzblog

Tezzaron works closely with both Ziptronix and Invensas – and now the parent of Invensas (Tessera) has acquired Ziptronix!  This link-up is good news for the 3D community and further strengthens Tezzaron’s relationships.  See the 3D InCites report:
With the Acquisition of Ziptronix, Tessera … [Read More]

Yesterday’s press release stirred up interest and press coverage at home and abroad.  Click below for an especially interesting article written by Francoise von Trapp in 3D InCites:
Move Over 3D Memory, Logic-on-Logic Stacks Have Arrived!

Other coverage included: AZO NANO, Beijing Bulletin, IHS … [Read More]

Tezzaron and Novati announce an 8-layer wafer stack containing high-performance CMOS logic — the most wafers ever assembled in such a stack!  There are no wire bonds, copper pillars, bumps, or underfill between the layers, just ultra-thin wafers with circuitry, connected vertically with tiny tungsten SuperContacts™.  This is the densest … [Read More]

Back in 1994, William Wulf and Sally McKee described the “Memory Wall” that hobbled computer performance. Francoise von Trapp now describes how that wall is being conquered in 3D by Tezzaron and others.  See her article: With 3D Memory Cubes You Can Finally Break Down the … [Read More]

What’s 2.5D, and why is it suddenly so poplar?  Semiconductor Engineering says the stacked die approach is steadily gaining share, “but there are lots of surprises as to where, how and why.”  Silicon interposers are the big winner.  They quote our own Bob Patti: “People are becoming a … [Read More]