Three new reports cite Tezzaron Jul15 By Webmaster • Posted in Tezzaron in the News July 15, 2016 Tezzaron is cited in three new industry reports announced this week: 3D TSV Packages Market 2016-2026 Shares, Trend and Growth Report Press release from: Future Market Insights Emerging Non-Volatile Memory – 2016 Report by Yole Developpement 3D IC Market by Substrate Type and by Fabrication Process Report by Market Research … [Read More]
Global 3D IC Market Rising Jul11 By Webmaster • Posted in Industry News July 11, 2016 Two recent reports give rosy predictions: Global 3D IC Market Set for Rapid Growth, To Reach Around USD 8.6 Billion by 2020 and Global 3D ICs Market to Log 18.1% CAGR till 2019 with Growing Demand
Tezzaron presentation to Potomac Institute Jun3 By Webmaster • Posted in Tezzaron Presents June 3, 2016 On May 27, Bob Patti of Tezzaron presented a Hardware Security Symposium at the Potomac Institute for Policy Studies. “Microelectronics are key components in our defense systems, and assuring that they are both readily available and secure is critical for US national security. Hardware-based threats can have … [Read More]
Cadence® press release touts Tezzaron as a customer May11 By Webmaster • Posted in Tezzaron in the News May 11, 2016 Tezzaron uses tools from several vendors, including Cadence Design Systems, Inc. On Monday Cadence issued this press release: “Tezzaron Cuts Design Time in Half with Cadence Full-Flow Digital RTL-to-Signoff Solution”
It’s All About the Memory! Apr15 By Webmaster • Posted in Industry News April 15, 2016 Remember when CPU speed was all-important? Things have changed. The mighty CPU is no longer the center of the computing universe; nowadays it’s all about the memory. (A Tezzaron memory chip is pictured above.) Memory-centric architectures are on the rise, as described by Ed Sperling in his latest … [Read More]