Labs and industry perfect 3-D chip Dec8 By Webmaster • Posted in Tezzaron in the News December 8, 2008 Labs and industry perfect 3-D chip…read more on Symmetry
3-D Chip Stacks Standardized Jul10 By Webmaster • Posted in Tezzaron in the News July 10, 2008 The Intimate Memory Interconnect Standard (IMIS) being promoted by the 3D-IC Alliance recently released its official specification for 3-D stacking memory chips…read more on EEtimes
3D-ICs and Integrated Circuit Security Jan31 By Webmaster • Posted in Documents January 31, 2008 A Tezzaron white paper. Download pdf: 3D-ICs and Integrated Circuit Security
Tezzaron in the News: 2007 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2007 October 2007: $50 3D Bonding Coming?? (Perspectives from the Leading Edge) October 2007: IC Packages Feel the Squeeze (Electronic Design) June 2007: Tezzaron, Chartered working on 2D “iRAM” hybrid, 3D ICs to come (Wafer News) June 2007: Chartered, Tezzaron team for high-speed 3D memory chips (EDN) June 2007: Design in … [Read More]
Chartered, Tezzaron Team Up to Deliver Ultra High-Speed Memory Solution Jun12 By Webmaster • Posted in Press Releases June 12, 2007 Leading foundry, innovative chip designer will also collaborate on breakthrough 3D ICs using wafer stacking approach MILPITAS, Calif. – June 12, 2007 Chartered Semiconductor Manufacturing (Nasdaq: CHRT and SGX-ST: Chartered), one of the world’s top dedicated foundries, and Tezzaron Semiconductor, a specialist in high-speed memory solutions and three-dimensional (3D) wafer stacking processes, … [Read More]