Tezzaron in the News: 2012 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2012 December 2012: RTI 3D ASIP Part I (Insights from the Leading Edge) December 2012: News from 3-D Architectures for Semiconductor Integration and Packaging (Chip Scale Review) December 2012: A*STAR’s Institute of MicroElectronics Launches 2.5D Silicon Interposer Multi-Project Wafer Offering on 300mm Technology Platform (IME Press Release) December … [Read More]
Ziptronix Licenses DBI® and ZiBond® to Tezzaron Dec12 By Webmaster • Posted in Press Releases December 12, 2012 Ziptronix Licenses Direct Bond Interconnect (DBI®) and ZiBond® Patented Technologies to Tezzaron Semiconductor for Advanced 3D Memory and 3D Integrated Assemblies RESEARCH TRIANGLE PARK, N.C., December 12, 2012 Ziptronix, Inc. has signed a licensing agreement with Tezzaron Semiconductor for the use of patents regarding Ziptronix’s direct bonding technologies, ZiBond™ and DBI®. “There is … [Read More]
Tezzaron Semiconductor Completes Acquisition of SVTC’s Austin Fab, Now Novati Technologies Oct22 By Webmaster • Posted in Press Releases October 22, 2012 Naperville, IL and Austin, TX (22 October, 2012) Tezzaron Semiconductor’s acquisition of the former SVTC facility in Austin is complete. The fab now operates as a newly formed Texas corporation, “Novati Technologies, Inc.,” with Tezzaron as the sole shareholder of the corporation. The deal closed on Monday, Oct. 15, 2012. The acquisition … [Read More]
Tezzaron Acquires Texas Semiconductor Facility Oct1 By Webmaster • Posted in Press Releases October 1, 2012 Naperville, IL – October 1, 2012 Tezzaron Semiconductor has signed a contract to purchase the assets of a semiconductor technology development and wafer fabrication facility in Austin, Texas, previously run by SVTC Technologies. Tezzaron will continue the operations of this unique facility while adding capabilities to assemble its own revolutionary three … [Read More]
Want some real-world insight into 2.5D and 3D IC design and assembly? Read on to get the word from Tezzaron Semiconductor Jul12 By Webmaster • Posted in Tezzaron in the News July 12, 2012 Ann Steffora-Mutschler just published an interview with Robert Patti, chief technology officer at Tezzaron Semiconductor, that gives some terrific technical detail about 2.5D and 3D IC design and assembly. Patti provides some rare insight into today’s (as in right now) 2.5D/3D state of the art through some really interesting qualitative … [Read More]