3D and the “Internet of Things” Jul29 By Webmaster • Posted in Industry News July 29, 2014 “IoT” is the hot new buzzword. How does 3D/2.5D fit into this paradigm? Herb Reiter makes some very good points in his 3D InCites article: …One Plus One is More Than Two
Permanent Wafer Bonding Jul28 By Webmaster • Posted in Industry News July 28, 2014 There are many ways to stick two wafers together. Tezzaron uses two permanent bonding methods: copper thermo-compression and copper/oxide “hybrid” – the latter developed by Ziptronix and licensed to us. Hybrid bonding gets a vote of confidence in Amandine Pizzagalli’s recent summary (in 3D InCites): [Read More]
Network-on-Chip Jul25 By Webmaster • Posted in Industry News July 25, 2014 Let others argue about the demise of Moore’s Law. (Next year? Yesterday?) K. Charles Janac defines a solid pathway to future electronics in his EE Times piece: “Life After 28nm: Think Network-on-Chip”
The INFIERI Summer School – Paris Jul16 By Webmaster • Posted in Slide Presentations July 16, 2014 Tezzaron is an Associated Partner with the INFIERI network. (INFIERI = INtelligent, Fast, Interconnected and Efficient devices for Frontier Exploitation in Research and Industry.) At the INFIERI 2014 Summer School in Paris, Bob Patti presented an Introduction to 2.5/3D Semiconductors.
Next-Generation Fusion Wafer Bonding Jul14 By Webmaster • Posted in Industry News July 14, 2014 Tezzaron’s thermal diffusion bonding relies on equipment from EVG. Their new advance in alignment accuracy is terrific news! Read the article in Solid State Technology: “EVG clears key barriers”