The Tezzblog

Novati Technologies, Tezzaron’s manufacturing subsidiary in Austin, has been awarded the coveted “Trusted Foundry” accreditation.  Novati is one of only nine companies so designated by the U.S. Department of Defense. “Trusted Foundries” are qualified to perform highest-security semiconductor production.  You can read the Novati press release … [Read More]

A report from Research and Markets highlights the bright future of 3D and 2.5D.

Tezzaron’s first working 3D memory chip – a memory stack with through-silicon vertical interconnect – appeared in 2004. Since then our memory stacks have grown continually more sophisticated, with hugely increased capacity. Finally, at the GSA 3D IC Packaging Working Group meeting (July 23), … [Read More]

Austria’s EV Group (EVG) supplies the excellent equipment Tezzaron uses for copper thermal diffusion bonding.  Solid State Technology has published a story about their latest achievements:
“Fusion bonding for next-generation 3D-ICs”

Yes, Tezzaron is real!

In a thoughtful “3D InCites” post, Francoise von Trapp says that 3D products in small niche markets are just as “real” as in high-volume manufacturing. (And industry spokespersons can’t agree on the definition of “high-volume” anyway.)  You can read her entire article [Read More]