Tezzaron in the News: 2010 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2010 December 2010: 3D Test Workshop Gets the Ball Rolling (Chip Scale Review) December 2010: Testing 3D ICs Deep in the Heart of Texas (Insights From the Leading Edge) December 2010: IEEE 3D IC Test Workshop Part 2 (Insights From the Leading Edge) December 2010: The Future is Here … Bob Patti: 3D @ Tezzaron (EDA Confidential blog) December 2010: 3D: Design. Deploy. Dominate. (EDN blog, “Superheroes of SOC”) December 2010: Progress in 3-D IC production (Media & Entertainment Technologies) December 2010: Focus on 3D TEST at IEEE Workshop (Advanced Packaging) November 2010: First 3D-TEST Workshop (3D InCites blog) November 2010: Manufacturing Service on 3D ICs (Slides from the IEEE 3DIC Conference in Munich) August 2010: Global 3D Chips/3D IC Market to Reach US$5.2 Billion by 2015 (PRWeb) July 2010: 3D Infrastructure Announcements and Rumors (Insights From the Leading Edge) June 2010: CMP/CMC/MOSIS partner to introduce a 3D-IC process (Joint press release) March 2010: 3-D IC at the IMAPS Packaging Conference (Perspectives from the Leading Edge) March 2010: IMAPS Experts Debate 3_D Cost Challenges (Semiconductor International) January 2010: 2009 SEMI Awards for North America Bestowed on Robert Patti of Tezzaron Semiconductor… (SEMI Press Release) January 2010: Congratulations, Bob Patti! (3D InCites)