Tezzaron in the News: 2008 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2008 December 2008: Labs and industry perfect 3-D chip (Symmetry) November 2008: You Can’t Always Get What You Want (Perspectives from the Leading Edge) October 2008: As ICs stack up, cleanliness levels may follow (CleanRooms) October 2008: Labs and companies collaborate on pixel detector technology (Fermilab Today) July 2008: Recent 3D IC Integration Activity (Perspectives from the Leading Edge) July 2008: 3-D Chip Stacks Standardized (EE Times) May 2008: 3D Road Tour contd (Perspectives from the Leading Edge) May 2008: 3D Integration Tour: Are TSVs the Future of Advanced Packaging? (Advanced Packaging) April 2008: 3D Circuit Design at Fermilab (Fermilab Conference presentation) March 2008: More 3D IC Integration from Ft. McDowell (Perspectives from the Leading Edge) January 2008: Tezzaron Develops 3D Sensors Using 3D IC Technology (Sensor Technology Alert)