Tezzaron in the News: 2007 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2007 October 2007: $50 3D Bonding Coming?? (Perspectives from the Leading Edge) October 2007: IC Packages Feel the Squeeze (Electronic Design) June 2007: Tezzaron, Chartered working on 2D “iRAM” hybrid, 3D ICs to come (Wafer News) June 2007: Chartered, Tezzaron team for high-speed 3D memory chips (EDN) June 2007: Design in the age of 3-D Stacking (EE Times) February 2007: Tezzaron readying MPW run for 3D memory/logic designs (WeSRCH) January 2007: Making the Business Case for 3D (Future Fab Intl.)