Tezzaron in the News: 2004 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2004 December 2004: Six 3D designs precede 90% power-saving claims from Tezzaron (EE Times) December 2004: RF applications will follow the 3D Interconnect path… (Mobile Dev & Design) December 2004: The ups and downs of three-dimensional circuits (EE Times) December 2004: Tezzaron debuts ‘super-8051’ chip with 3D technology (EE Times) November 2004: High-rise circuitry lures chip makers (Silicon Strategies) November 2004: 3D Interconnect Gets Real (Solid State Technology) November 2004: MagnaChip, Tezzaron form partnership for 3D chips (EE Times) April 2004: Tech firm’s stacked chips zip to market (Crain’s Chicago Business) April 2004: 3D Interconnect Technology Coming to Light (Electronic News)