Tezzaron/Tachyon in the News: 2001-2003 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2003 November 2003: Semiconductor Investment and the Future (Gilder Technology Report) (see “Consequences” near the bottom of page 3.) November 2003: New memory technology promises top speeds (Electronic Products) September 2003: Wafers Stack on Copper Super-Vias (SolidState Technology) August 2003: Tezzaron delivers challenge to SRAM, DRAM (EE Times) August 2003: Tezzaron prototypes pseudostatic memory (EE Times) August 2003: Tezzaron Semiconductor announces a prototype memory device with record-breaking speed (Design & Reuse) August 2003: Tezzaron rolls out ‘PSiRAM’ memory technology (EE Times) June 2003: Tezzaron devises multi-wafer stack for 3-D chips (EE Times) Note: Tezzaron was named “Tachyon Semiconductor” until mid-2003 February 2003: 3-D Stacking Reaches New Heights (Design & Reuse) February 2003: Tachyon devises 3D chip with four wafers (EE Times) July 2002: Tall Chips (Chicago Tribune) (see second half of article) June 2002: Los Alamos, Tachyon to develop 3D chips based on wafer-stacking process (EE Times) June 2002: Wafer Stacking Technology Promises Faster, Denser System-On-a-Chip (Design & Reuse) March 2002: Interview: Robert Patti of Tachyon Semiconductor (ePrairie) January 2002: Memory: Digital Brings More Memory, Gates, Speed (Electronic Design) November 2001: Re-Architected DRAMs Deliver Denser, Lower-Cost Storage (Electronic Design)