Tezzaron Builds 3D Sensors for Fermilab Apr9 By Webmaster • Posted in Tezzaron in the News April 9, 2014 “Each of the integrated circuits you see here is about 6 millimeters on a side and projects one one-thousandth of an inch above the surface of the larger sensor wafer on which it sits … Fermilab is behind the novel concept of the detector devices and design, which are known as 3-D integrated chips, and company Tezzaron fabricated them. Brookhaven National Laboratory built the sensor.” read the article in Fermilab Today