Tezzaron at the GSA Silicon Summit Apr10 By Webmaster • Posted in Tezzaron in the News April 10, 2014 “At the GSA Silicon Summit this afternoon there was a discussion of 3D IC and 2.5D IC. The session was moderated by Javier DeLaCruz of eSilicon and the panelists were: Calvin Cheung of ASE (an OSAT) Gil Lvey of OptimalTest (a test house) Bob Patti of Tezzaron (semiconductor company specializing in TSV-based designs) Riko Radojcic of Qualcomm (you don’t need me to tell you what they do) Arif Rahman of Altera (FPGAs, working with Intel on 3D apparently) Brandon Wang of Cadence (where he is director of 3D IC solutions)” read the article at SemiWiki.com