Permanent Wafer Bonding Jul28 By Webmaster • Posted in Industry News July 28, 2014 There are many ways to stick two wafers together. Tezzaron uses two permanent bonding methods: copper thermo-compression and copper/oxide “hybrid” – the latter developed by Ziptronix and licensed to us. Hybrid bonding gets a vote of confidence in Amandine Pizzagalli’s recent summary (in 3D InCites): Market Outlook for Permanent Wafer Bonding