The Tezzblog

Is Tezzaron’s 3D process “monolithic”?

In the world of 3D ICs, definitions tend to morph and shift at a dizzying rate.  There is disagreement on such basic terms as TSV, package, stack, and even 3D itself!  The recent IEEE 3D Test Workshop saw a redefinition of “Monolithic 3D IC” that would include Tezzaron’s stacking process.  So, are we monolithic?  And does it matter?  For a good recap of the discussion, read the article in 3D InCites.