Good press for Tezzaron’s 8-layer wafer stack Sep1 By Webmaster • Posted in Tezzaron in the News September 1, 2015 Yesterday’s press release stirred up interest and press coverage at home and abroad. Click below for an especially interesting article written by Francoise von Trapp in 3D InCites: Move Over 3D Memory, Logic-on-Logic Stacks Have Arrived! Other coverage included: AZO NANO, Beijing Bulletin, IHS Electronics 360, IXBT (in Russian), Kaiteki-Kaden Life, MarketWatch, News JS, Solid State Technology, Sys-con, WN.com, World News, Your News Ticker