Fermilab 3D Sensor Breakthrough Sep23 By Webmaster • Posted in Industry News September 23, 2014 A new 3D sensor prototype with extraordinary capabilities was recently revealed by Grzegorz Deptuch of Fermilab. The three-layer sensor, named VIPIC, is designed for particle detection in large-scale particle physics and x-ray imaging experiments. It exhibits higher and more uniform gain, higher signal amplitude, lower input capacitance, and much lower noise than a similar sensor built with bump-bond technology. We at Tezzaron are delighted and thrilled with these results, having been involved with the manufacturing of the new device: the 3D layers of VIPIC were built using the Ziptronix DBI process at our Novati facility in Raleigh, NC. Ziptronix announced the use of its technology in a press release on Sept. 9. Dr. Deptuch gave a technical presentation of the sensor results at the CPIX conference in Bonn, Germany (Sept 15-17). Tezzaron’s history of collaboration with Fermilab dates back to the 1980s.