Honeywell and Tezzaron to Build Rad Hard 3D-ICs Dec9 By Webmaster • Posted in Press Releases December 9, 2011 NAPERVILLE, Illinois – December 9, 2011 Honeywell Microelectronics and Tezzaron Semiconductor are working together to produce a new range of radiation-hardened (rad hard) integrated circuits. Honeywell’s sturdy, well-qualified S150 process will use Tezzaron’s 3D stacking to greatly increase circuit density without migrating to a smaller node. The resulting three-dimensional integrated circuits … [Read More]
A*STAR Institute of Microelectronics and Tezzaron Team Up To Develop 2.5D/3D Through-Silicon Interposer Technology Dec6 By Webmaster • Posted in Press Releases December 6, 2011 NAPERVILLE, Illinois – December 6, 2011 The A*STAR Institute of Microelectronics (IME) and Tezzaron Semiconductor, a leader in 3D-ICs, have today announced a research collaboration agreement to develop and exploit advanced Through Silicon Interposer (TSI) technology. The two organizations will improve and refine the design and manufacture of silicon interposers and … [Read More]
Ten Custom 3D-ICs From Tezzaron Jul22 By Webmaster • Posted in Press Releases July 22, 2011 Company reports growing demand for stacked silicon devices NAPERVILLE, Illinois – July 22, 2011 In the past month Tezzaron Semiconductor delivered ten different proprietary, custom-built 3D-ICs to several customers. Each of the ten designs featured two layers of silicon interconnected by hundreds of thousands of TSVs. “We have delivered custom 3D-ICs before … [Read More]
2009 SEMI Awards for North America Bestowed on Robert Patti of Tezzaron Semiconductor Jan12 By Webmaster • Posted in Press Releases January 12, 2010 SEMI today announced the recipients of the 2009 SEMI Awards for North America, which are the association’s highest honors for technical contribution to the semiconductor industry. The first SEMI Award for 2009 will be presented to Robert Patti, the chief technology officer of Tezzaron, Inc., for his pioneering work in the … [Read More]
Chartered, Tezzaron Team Up to Deliver Ultra High-Speed Memory Solution Jun12 By Webmaster • Posted in Press Releases June 12, 2007 Leading foundry, innovative chip designer will also collaborate on breakthrough 3D ICs using wafer stacking approach MILPITAS, Calif. – June 12, 2007 Chartered Semiconductor Manufacturing (Nasdaq: CHRT and SGX-ST: Chartered), one of the world’s top dedicated foundries, and Tezzaron Semiconductor, a specialist in high-speed memory solutions and three-dimensional (3D) wafer stacking processes, … [Read More]