Tezzaron in the News

Looking Forward

In “Seeking Alpha,” Robert Castellano says:

“Looking forward, in the semiconductor space, one of the most challenging technologies with the greatest upside is 3D …”

He specifically highlights “… 3D chip packaging using through silicon via technology (TSV) by UMC (NYSE:UMC), STATS ChipPAC, and Tezzaron.”

See the article here.

Tezzaron Announces World’s First Eight-Layer Active Wafer Stack

Tezzaron and Novati announce an 8-layer wafer stack containing high-performance CMOS logic — the most wafers ever assembled in such a stack!  There are no wire bonds, copper pillars, bumps, or underfill between the layers, just ultra-thin wafers with circuitry, connected vertically with tiny tungsten SuperContacts™.  This is the densest … [Read More]