Looking Forward Oct22 By Webmaster • Posted in Tezzaron in the News October 22, 2015 In “Seeking Alpha,” Robert Castellano says: “Looking forward, in the semiconductor space, one of the most challenging technologies with the greatest upside is 3D …” He specifically highlights “… 3D chip packaging using through silicon via technology (TSV) by UMC (NYSE:UMC), STATS ChipPAC, and Tezzaron.” See the article here.
Tezzaron 3D Memory Chips in EE Times Sep30 By Webmaster • Posted in Tezzaron in the News September 30, 2015 Following up on our 8-layer stack press release, a glowing EE Times article provides great coverage of the work being done by Tezzaron and Novati. Dave Anderson (Novati CEO) is quoted at length about the wide range of exciting technologies performed at the Austin … [Read More]
More Synergy in 3D Sep4 By Webmaster • Posted in Tezzaron in the News September 4, 2015 Tezzaron works closely with both Ziptronix and Invensas – and now the parent of Invensas (Tessera) has acquired Ziptronix! This link-up is good news for the 3D community and further strengthens Tezzaron’s relationships. See the 3D InCites report: With the Acquisition of Ziptronix, Tessera … [Read More]
Good press for Tezzaron’s 8-layer wafer stack Sep1 By Webmaster • Posted in Tezzaron in the News September 1, 2015 Yesterday’s press release stirred up interest and press coverage at home and abroad. Click below for an especially interesting article written by Francoise von Trapp in 3D InCites: Move Over 3D Memory, Logic-on-Logic Stacks Have Arrived! Other coverage included: AZO NANO, Beijing Bulletin, IHS … [Read More]
Tezzaron Announces World’s First Eight-Layer Active Wafer Stack Aug31 By Webmaster • Posted in Press Releases August 31, 2015 Tezzaron and Novati announce an 8-layer wafer stack containing high-performance CMOS logic — the most wafers ever assembled in such a stack! There are no wire bonds, copper pillars, bumps, or underfill between the layers, just ultra-thin wafers with circuitry, connected vertically with tiny tungsten SuperContacts™. This is the densest … [Read More]