Ziptronix®, Tezzaron® Announce Alliance for 3D ICs Feb28 By Webmaster • Posted in Press Releases February 28, 2005 Technologies called “compatible and complementary” 28 February 2005 Two leading forces in 3D integrated circuits, Tezzaron and Ziptronix, today announced their intent to cooperate in joint development and marketing efforts. As pioneers in 3D IC technology, both companies are working towards a general industry adoption of 3D solutions. The collaboration … [Read More]
Tezzaron® Unveils 3D SRAM Jan24 By Webmaster • Posted in Press Releases January 24, 2005 Third 3D IC Confirms FaStack™ Process Naperville – 24 January 2005 Tezzaron Semiconductor has built a 1 Megabit SRAM as a three-dimensional integrated circuit (3D IC). This new device, the third design to be built in Tezzaron’s FaStack wafer stacking process, uses a 100-pin TQFP package with industry standard pinout and interface. Tezzaron … [Read More]
Tezzaron in the News: 2004 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2004 December 2004: Six 3D designs precede 90% power-saving claims from Tezzaron (EE Times) December 2004: RF applications will follow the 3D Interconnect path… (Mobile Dev & Design) December 2004: The ups and downs of three-dimensional circuits (EE Times) December 2004: Tezzaron debuts ‘super-8051’ chip with 3D technology (EE Times) November 2004: High-rise circuitry … [Read More]
3D Semiconductors Poised for Revolution Dec23 By Webmaster • Posted in Press Releases December 23, 2004 Singapore – 23 December 2004 Tezzaron® Semiconductor announced that its 3D technology is ready to launch the semiconductor industry into a new era. “Migration from 2D to 3D is inevitable,” says Dr. Subhash Gupta, Managing Director. His confidence is based on the success of Tezzaron’s first six prototype designs, which demonstrated … [Read More]
Third Dimension Triples Processor Speed Dec6 By Webmaster • Posted in Press Releases December 6, 2004 Naperville, IL – 6 December 2004 Tezzaron Semiconductor has demonstrated a new 8051-based microprocessor that is 2 to 10 times faster than typical 8051 designs, running at speeds of up to 140 MHz under lab conditions. The microprocessor’s secret is its three-dimensional architecture: the processor is on one layer and 128 … [Read More]