Bob Patti, Tezzaron Semiconductor, at the RTI 3D Architectures for Semiconductor Integration and Packaging 2011 Dec20 By Webmaster • Posted in Tezzaron in the News December 20, 2011 Bob Patti, CTO, Tezzaron Semiconductor, talks about the challenges and opportunities 3D integration brings to the semiconductor manufacturing industry, and Tezzaron’s role in bringing 3D IC integration to market… watch video
Honeywell and Tezzaron to Build Rad Hard 3D-ICs Dec9 By Webmaster • Posted in Press Releases December 9, 2011 NAPERVILLE, Illinois – December 9, 2011 Honeywell Microelectronics and Tezzaron Semiconductor are working together to produce a new range of radiation-hardened (rad hard) integrated circuits. Honeywell’s sturdy, well-qualified S150 process will use Tezzaron’s 3D stacking to greatly increase circuit density without migrating to a smaller node. The resulting three-dimensional integrated circuits … [Read More]
A*STAR Institute of Microelectronics and Tezzaron Team Up To Develop 2.5D/3D Through-Silicon Interposer Technology Dec6 By Webmaster • Posted in Press Releases December 6, 2011 NAPERVILLE, Illinois – December 6, 2011 The A*STAR Institute of Microelectronics (IME) and Tezzaron Semiconductor, a leader in 3D-ICs, have today announced a research collaboration agreement to develop and exploit advanced Through Silicon Interposer (TSI) technology. The two organizations will improve and refine the design and manufacture of silicon interposers and … [Read More]
Ten Custom 3D-ICs From Tezzaron Jul22 By Webmaster • Posted in Press Releases July 22, 2011 Company reports growing demand for stacked silicon devices NAPERVILLE, Illinois – July 22, 2011 In the past month Tezzaron Semiconductor delivered ten different proprietary, custom-built 3D-ICs to several customers. Each of the ten designs featured two layers of silicon interconnected by hundreds of thousands of TSVs. “We have delivered custom 3D-ICs before … [Read More]
Mentor Graphics Works With Tezzaron and MOSIS on 3D-IC Prototyping Service Jun3 By Webmaster • Posted in Tezzaron in the News June 3, 2011 Mentor Graphics Corporation (NASDAQ: MENT) today announced a cooperative effort with Tezzaron Semiconductor and MOSIS to provide IC designers with a way to economically develop and manufacture 3D-IC prototypes on multi-project wafers (MPWs). The process enables designs using tens of millions of through silicon vias (TSVs) with dimensions as small … [Read More]