Tezzaron in the News

Honeywell and Tezzaron to Build Rad Hard 3D-ICs

NAPERVILLE, Illinois – December 9, 2011

Honeywell Microelectronics and Tezzaron Semiconductor are working together to produce a new range of radiation-hardened (rad hard) integrated circuits. Honeywell’s sturdy, well-qualified S150 process will use Tezzaron’s 3D stacking to greatly increase circuit density without migrating to a smaller node. The resulting three-dimensional integrated circuits … [Read More]

A*STAR Institute of Microelectronics and Tezzaron Team Up To Develop 2.5D/3D Through-Silicon Interposer Technology

NAPERVILLE, Illinois – December 6, 2011

The A*STAR Institute of Microelectronics (IME) and Tezzaron Semiconductor, a leader in 3D-ICs, have today announced a research collaboration agreement to develop and exploit advanced Through Silicon Interposer (TSI) technology. The two organizations will improve and refine the design and manufacture of silicon interposers and … [Read More]

Ten Custom 3D-ICs From Tezzaron

Company reports growing demand for stacked silicon devices

NAPERVILLE, Illinois – July 22, 2011

In the past month Tezzaron Semiconductor delivered ten different proprietary, custom-built 3D-ICs to several customers. Each of the ten designs featured two layers of silicon interconnected by hundreds of thousands of TSVs. “We have delivered custom 3D-ICs before … [Read More]

Mentor Graphics Works With Tezzaron and MOSIS on 3D-IC Prototyping Service

Mentor Graphics Corporation (NASDAQ: MENT) today announced a cooperative effort with Tezzaron Semiconductor and MOSIS to provide IC designers with a way to economically develop and manufacture 3D-IC prototypes on multi-project wafers (MPWs). The process enables designs using tens of millions of through silicon vias (TSVs) with dimensions as small … [Read More]