Tezzaron: You’ve got our attention now Aug29 By Webmaster • Posted in Tezzaron in the News August 29, 2013 “Tezzaron Founder and CTO Bob Patti delivered a rousing keynote at the Silicon Valley Magma User Group meeting back in 2010, talking about his company’s 3D memory technology and how it offered a solution to the increased demands for on-chip capacity. I spoke to Patti following that speech…” [Read More]
Novati in the Press Jul1 By Webmaster • Posted in Press Releases July 1, 2013 Novati (our fab in Austin) gets great press: “Novati takes old chip assets to build a new kind of fab” (GigaOm) and “Novati Covers the Periodic Table” (SemiWiki) and “Novati Technologies Launches Nanofabrication Center with World’s Largest Portfolio of Product Development Materials” (BusinessWire)
Mentor and Tezzaron Optimize Calibre 3DSTACK for 2.5/3D-ICs May20 By Webmaster • Posted in Press Releases May 20, 2013 WILSONVILLE, Ore., May 20, 2013 Mentor Graphics Corp. (NASDAQ: MENT) and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate the Mentor® Calibre® 3DSTACK product into Tezzaron’s 3D-IC offerings. The new integration will focus on fast, automated verification of die-to-die interactions in 2.5D and 3D stacked die configurations by verifying … [Read More]
Novati Technologies Licenses Ziptronix’s Direct Oxide Bonding (ZiBond®) and Direct Bond Interconnect (DBI®) Patented Technologies For Advanced 3D Integrated Assemblies Jan16 By Webmaster • Posted in Press Releases January 16, 2013 RESEARCH TRIANGLE PARK, N.C. – Jan. 16, 2013 Ziptronix, Inc. has signed a licensing agreement with Novati Technologies, Inc. for the use of its patents covering direct bonding technology, ZiBond® and DBI®. “We believe that Ziptronix’s patented direct bonding technology enables the industry’s best performance for applications such as 3D memory, BSI … [Read More]
Tezzaron in the News: 2012 Dec31 By Webmaster • Posted in Tezzaron in the News December 31, 2012 December 2012: RTI 3D ASIP Part I (Insights from the Leading Edge) December 2012: News from 3-D Architectures for Semiconductor Integration and Packaging (Chip Scale Review) December 2012: A*STAR’s Institute of MicroElectronics Launches 2.5D Silicon Interposer Multi-Project Wafer Offering on 300mm Technology Platform (IME Press Release) December … [Read More]