Tezzaron in the News

Tezzaron: You’ve got our attention now

“Tezzaron Founder and CTO Bob Patti delivered a rousing keynote at the Silicon Valley Magma User Group meeting back in 2010, talking about his company’s 3D memory technology and how it offered a solution to the increased demands for on-chip capacity. I spoke to Patti following that speech…” [Read More]

Mentor and Tezzaron Optimize Calibre 3DSTACK for 2.5/3D-ICs

WILSONVILLE, Ore., May 20, 2013

Mentor Graphics Corp. (NASDAQ: MENT) and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate the Mentor® Calibre® 3DSTACK product into Tezzaron’s 3D-IC offerings. The new integration will focus on fast, automated verification of die-to-die interactions in 2.5D and 3D stacked die configurations by verifying … [Read More]

Novati Technologies Licenses Ziptronix’s Direct Oxide Bonding (ZiBond®) and Direct Bond Interconnect (DBI®) Patented Technologies For Advanced 3D Integrated Assemblies

RESEARCH TRIANGLE PARK, N.C. – Jan. 16, 2013

Ziptronix, Inc. has signed a licensing agreement with Novati Technologies, Inc. for the use of its patents covering direct bonding technology, ZiBond® and DBI®.

“We believe that Ziptronix’s patented direct bonding technology enables the industry’s best performance for applications such as 3D memory, BSI … [Read More]