Resources

MemCon is the memory industry’s premier technical and ecosystem event.  MemCon 2015 (October 13, Santa Clara) featured a plethora of excellent presentations on markets, architecture, systems, etc.  Tezzaron was a sponsor of the event.  Our VP of Marketing, Dave Chapman, gave the opening presentation in the Market … [Read More]

April 27-29 2015 saw the Vth INFIERI Workshop in Geneva, Switzerland – home of CERN and its Large Hadron Collider.  The high-level workshop was organized by the INFIERI consortium. Three days of plenary sessions covered the latest developments in detectors, imaging, data … [Read More]

Grenoble (France) hosted this year’s Design, Automation, and Test in Europe (DATE) conference and exhibition.  The conference featured tutorials and technical sessions that attracted 1450 experts from around the world.  The last day of the conference included a 3D Integration Workshop at which Tezzaron presented: How … [Read More]

How trustworthy is an integrated circuit?  That depends.  Who designed it?  Who built it?  Whose software was embedded in it?  Whose hands were on it during the whole process?  Could confidential functionality have been compromised along the way?

Chips that are implemented in critical systems need a very high degree of … [Read More]

The 2014 Electronics Packaging Symposium was held Oct 8-9 at IEEC, Binghamton University, in New York. This year’s event covered several small-scale technologies, including 3D and 2.5D, and featured a 2.5D & 3D Packaging Workshop.

Bob Patti of Tezzaron presented 2.5/3D Integration Technology and … [Read More]